Item |
Capability |
Details |
---|---|---|
Aluminium |
Maximum finished size |
610 mm×1200 mm |
|
Final board thickness |
0.5 mm - 5.0 mm |
|
Board thickness tolerance |
+/-10% |
|
Copper Thickness |
0.5 oz - 10 oz |
|
Warp and Twist |
≤0.75% |
Thermal Conductivity |
1 W - 3 W |
1 W/(m·K), 1.5 W/(m·K), 2 W/(m·K), 3 W/(m·K) |
Minimum Trace Width |
0.2 mm |
0.2 mm |
Minimum Line Space |
0.2 mm |
0.2 mm |
Profile |
Punching profile tolerance |
±0.13 mm |
|
Routing profile tolerance |
±0.1 mm |
|
Conductors & outline tolerance |
±0.15 mm |
V - cut |
V-cut angle |
30 ± 5° |
|
Tolerance of remain thickness |
±0.1 mm |
|
V-cut dimension tolerance |
±0.13 mm |
|
Groove width |
≤0.5 mm |
|
Groove to groove |
≥20 mm |
|
Groove to trace |
≥0.45 mm |
Surface Finish |
Lead free HASL thickness |
1-40 μm |
|
Au thickness of Immersion Au |
1-5 u” |
|
Ni thickness of Immersion Au |
80-200 u” |
Surface Finish |
Solder mask registration tolerance |
±0.05 mm |
|
Solder mask thickness |
≥10 μm |
|
Solder mask line width |
≥0.1 mm |
|
Line to solder PAD |
0.1 mm |
|
Solder PAD to solder PAD |
0.2 mm |
Hole |
Minimum drilled hole size |
0.5 mm |
|
Drilling hole diameter Tolerance |
±0.075 mm |
|
Hole position tolerance(first) |
±0.06 mm |
|
Hole position tolerance(second) |
±0.12 mm |
|
Hole edge to hole edge |
≥0.15 mm |
|
Hole edge to circuit |
≥0.2 mm |